New Approach to Semiconductor Packaging Brings Dramatic Improvements
in Thermal Conductivity, Performance at Lower Cost
OAKLAND, Calif.–(BUSINESS WIRE)–RJR
Polymers, a leading developer of high performance, air cavity
packages (ACPs), announced today it will demonstrate its innovative
LCP semiconductor packaging technology at this year
Article source: http://www.businesswire.com/news/home/20110531005757/en/RJR-Polymers-Showcases-Liquid-Crystal-Polymer-LCP